Are you looking job opportunities at STATS ChipPAC company in Singapore? Right place you are reached. We listed all latest job opportunities at STATS ChipPAC company in Singapore.
Company : STATS ChipPAC
Job : various
Location : Singapore
About STATS ChipPAC
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets. With a broad technology portfolio ranging from leadframe and laminate packages to advanced fan-out and fan-in wafer level technology, flip chip interconnect, System-in-Package (SiP), Through Silicon Via (TSV) and 2.5D/3D packaging, STATS ChipPAC provides customers with innovative and cost-effective semiconductor solutions. STATS ChipPAC differentiates itself through innovative packaging solutions in embedded Wafer Level Ball Grid Array (eWLB), encapsulated Wafer Level Chip Scale Packaging (eWLCSP) and fcCuBE® technology as well as our breakthrough wafer level manufacturing method known as FlexLineTM.
|Buyer - Equipment & Services||View & Apply|
|Accountant||View & Apply|
|Associate Process Engineer-LS (Wirebond)||View & Apply|
|Test Development Engineer (ATE)||View & Apply|
|Test Development Engineer (SLT)||View & Apply|
|Test Product Engineer||View & Apply|
|SENIOR / QA ENGINEER (SQE)||View & Apply|
|Associate Equipment Engineer (Ball Attach)||View & Apply|
|Associate Equipment Engineer - LS (Pre Assembly)||View & Apply|
How to Apply
Interested and eligible candidates are requested to apply by online method through the link given on above table. The candidates may required to click “View & Apply” button to view the details of particular job and to apply online. Candidates are requested to read the details carefully before applying.