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Latest Job Opportunities at STATS ChipPAC – Singapore

Are you looking job opportunities at STATS ChipPAC company in Singapore? Right place you are reached. We listed all latest job opportunities at STATS ChipPAC company in Singapore.

Company : STATS ChipPAC
Job : various
Location : Singapore


STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets. With a broad technology portfolio ranging from leadframe and laminate packages to advanced fan-out and fan-in wafer level technology, flip chip interconnect, System-in-Package (SiP), Through Silicon Via (TSV) and 2.5D/3D packaging, STATS ChipPAC provides customers with innovative and cost-effective semiconductor solutions. STATS ChipPAC differentiates itself through innovative packaging solutions in embedded Wafer Level Ball Grid Array (eWLB), encapsulated Wafer Level Chip Scale Packaging (eWLCSP) and fcCuBE® technology as well as our breakthrough wafer level manufacturing method known as FlexLineTM.

Read : Latest Job at L’Oréal – Singapore

Vacancies available

Buyer - Equipment & ServicesView & Apply
AccountantView & Apply
Associate Process Engineer-LS (Wirebond)View & Apply
Test Development Engineer (ATE)View & Apply
Test Development Engineer (SLT)View & Apply
Test Product EngineerView & Apply
Associate Equipment Engineer (Ball Attach)View & Apply
Associate Equipment Engineer - LS (Pre Assembly)View & Apply

How to Apply

Interested and eligible candidates are requested to apply by online method through the link given on above table. The candidates may required to click “View & Apply” button to view the details of particular job and to apply online. Candidates are requested to read the details carefully before applying.

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